Review – Asgard Freyr T3 3600 CL14 2x16GB – A 32GB Samsung B-Die DDR4 from AliExpress!

In this review, I will analyze another memory kit from Asgard, belonging to the “Freyr T3” series, which offers models ranging from 3000MHz to 3600MHz, in 8 GB or 16 GB modules that can be purchased individually or in 16 GB or 32 GB kits. The product being reviewed is a 32GB kit consisting of two 16 GB modules, with a frequency of 3600MHz, timings of 14-15-15-35, and an operating voltage of 1.45V.

The memory modules come packaged in a rectangular box featuring a photo of the product and an illustration of the Norse god Freyr, from whom the product derives its name. On the back of the box, you can find detailed explanations regarding Freyr and information about the memories, including labels indicating their capacity and frequency.

In addition to the external packaging, the memory modules are further protected by a second box. Along with the product, you will find a pair of anti-static gloves included. The RAM modules themselves come with protective covers on their contacts, ensuring added safety during handling.

Regarding the heatsink, for this series, Asgard has opted for a simple aluminum heatsink without any kind of lighting, resulting in a sleek looking DIMMs. Although the heatsinks may appear white in the photos, they are actually silver in color. It is worth noting that for this specific model, they are only offered in this color.

Upon removing the heatsink, which fortunately turned out to be a relatively simple task, it becomes evident that, similar to other memory modules in the Freyr T3 series, it does not make contact with two of the chips on each side of the PCB. This is due to the raised rune illustration on the heatsink, which necessitates a shorter thermal interface, which is not ideal.

In terms of the memory chips, Asgard has chosen to utilize Samsung B-Die, which is expected considering the specifications. There is no other DDR4 chip capable of operating at these parameters. However, in this case, we have 16 GB modules, which means they are “dual-rank,” or putting it simple, the chips are present on both sides of the PCB.

“Dual-rank” modules tend to place greater demands on the CPU’s memory controller, and the ODT settings may differ from those of “single-rank” modules. Fortunately, modern AMD and Intel platforms generally handle this well, provided you have a good motherboard and a processor with a strong memory controller. This combination enables you to run “dual-rank” modules at higher frequencies.

Thaiphoon Burner confirmed what was already established upon removing the heatsink: the presence of Samsung B-Die chips and a rev.B2 PCB.

Finally, if anyone is interested, you can check out the product page on the manufacturer’s official store on AliExpress through this link. This is an affiliate link, so if you make a purchase through it, you will be supporting the website.

• Hardware:

CPU: AMD Ryzen 3 5350G (Thanks AMD!)

MOBO: MSI MEG B550 Unify-X (UEFI A.43O)

RAM: 2x16GB Asgard Freyr T3 3600 CL14 1.45V

GPU: Powercolor RX 6800 XT Red Devil

PSU: Cooler Master MWE GOLD 1250W V2

COOLER: 1STPlayer ST-360

SSD: Sandisk 120 GB

Software: Windows 10 x64, TM5 0.12 1usmus config v3, AIDA64 6.32.5600, Geekbench 3.4.2, y-cruncher 1b.

Objective and testing methodology: The objective of the tests was to determine the daily usage limit of the Asgard Freyr T3 memory modules using the Ryzen 3 PRO 5350G processor, as well as the maximum frequency achievable for benchmarks on this platform. To facilitate the understanding of the results, they were divided into two groups:

XMP: This refers to the maximum achievable by simply loading the XMP profile and increasing the clock speed and voltage, stopping at 4733MHz with a 1:1 ratio and FCLK set to 2366MHz, which is the limit for the Ryzen 3 PRO 5350G processor used in this test. However, reaching this frequency depends on whether the memory being tested can reach it.

The advantage of this approach is its simplicity, as it requires no manual adjustment of timings by the user. However, the trade-off for this simplicity is lower performance since the motherboard automatically adjusts the settings, which can result in more relaxed timings.

24/7 Fine-Tuning: In this approach, manual adjustments were made to all possible timings to achieve the best possible results with daily usability in mind. As a result, when possible, testing was conducted beyond 3800MHz to explore the memory’s limit on other CPUs or platforms that benefit from higher frequencies, for example, this includes the Renoir and Cezanne APUs as well as Intel CPUs.

However, for Ryzen 3000 and 5000 processors based on chiplets, the performance gains are usually best achieved by synchronizing the FCLK (Fabric Clock) with the memory at 3800MHz (DRAM) and 1900MHz (FCLK), which offers optimal performance and is relatively straightforward to achieve.

For both cases 1 and 2, the stability of the memory modules was tested using TM5 0.12 1usmus config v3. Additionally, AIDA64 was utilized to measure memory bandwidth and latency. Geekbench 3.4.2 and y-cruncher 1b were used to provide a better understanding of performance. In these tests, the CPU was locked at 4.3GHz with a voltage of 1.25V. These tools and settings allowed for a comprehensive evaluation of stability, memory performance, and overall system performance.

• XMP:

With this approach, stability was achieved in TM5 at 3800 MHz using a voltage of 1.5V. This result is considered good considering the minimal effort required to achieve this frequency. However, as we will see later, the timings end up being quite relaxed, failing to take full advantage of the greatest strength of Samsung B-Die chips, which is their ability to work with very tight timings.

• 24/7 Fine-Tuning:

With fine-tuning, significant improvements were achieved in several key timings relevant to performance, resulting in noticeable gains compared to XMP. Stability was achieved at 3800 MHz while keeping the primary timings unchanged but significantly tightening the subtimings. This was accomplished using a VDIMM of 1.5V, which is generally considered safe for memories equipped with these chips. In fact, many other models use this voltage as the standard.

Moreover, it was also possible to reach 4266 MHz with timings of 16-17-17-17-42-360 while maintaining the 1.5V voltage. This is an excellent achievement for those who have processors that benefit from higher frequencies, such as the Renoir/Cezanne APUs and Intel Comet Lake and Rocket Lake. However, it’s important to note that this may not be the limit of these memory modules, as the Ryzen 3 5350G processor used in the tests may have already experienced some degradation since it was new.

It is worth noting that Samsung B-Die chips are known to be sensitive to temperature, often exhibiting stability issues when the temperature exceeds 50°C. However, in these tests, such issues did not occur, and it was not necessary to use a fan directly blowing onto the memory modules, despite the suboptimal design of the heatsink. However, it is still advisable to maintain some airflow over the memories, especially considering that the tests were conducted on an open bench, whereas the temperature inside a case tends to be higher.

Below are the Read/Write/Copy/Latency scores from AIDA, the memory sub-test scores from Geekbench 3.4.2, and the results from y-cruncher 1b. These scores are highly influenced by the performance of the memory subsystem and are demanding in terms of stability. It’s important to note that all these results passed the stability test in TM5 0.12 v3 and, at least for these samples, represent performance that can be used on a daily basis.

• Conclusion:

The Asgard Freyr T3 3600CL14 showed good compatibility with AMD platforms, functioning normally with XMP. When overclocking with XMP settings, stability was achieved at 3800 MHz by simply increasing the memory voltage to 1.5V, which is a commendable achievement, especially considering the minimal effort required to reach this result.

With manual adjustments, it was possible to achieve 3800 MHz at 14-15-15-15-28 with a tRFC of 260 and 1.5V, which proved to be a good configuration for daily use on Ryzen 3000 and 5000 CPUs based on chiplets. For those who have CPUs that benefit from high memory frequencies, it was also possible to reach 4266 MHz at 16-17-17-17-42-360 with the same 1.5V, which is only viable with high-quality Samsung B-Die chips.

Regarding competitive benchmark results, unfortunately, they will have to be covered in a future opportunity, as the Ryzen 3 5350G has already “endured” a lot in its lifespan and can no longer sustain the same frequencies as when it was new.

Regarding availability and price, as of July 3, 2023, the Asgard Freyr T3 3600CL14 is being sold for around 69 USD, which is a killer deal for a 32 GB (2×16 GB) DDR4 kit equipped with Samsung B-Die chips, even considering that it’s a little bit more expensive than the 32 GB kits equipped with another ICs. It’s important to remember that Samsung B-Die kits are available in 3600 MHz CL14 and 4000 MHz CL16 specifications, while other kits in the same series use different chips.